Tungsten Probe Needles

The probe is the core part of the probe card, used for the interface between the electronic component and the testing machine, so that the wafer test can actually be tested. Probe usage: It is the core component of the probe card and is used as a connected component. It is tested separately by transmitting electrical signals to the pads of the chip to distinguish good products from faulty products Material: Tungsten (WNP), Rhenium Tungsten (WRNP), P4, P7, BC Specifications are customized according to customer needs Customized production can be made according to customer drawings and samples Stable quality and fast delivery Country of Origin: United States Processing place: Taiwan

In addition, rhenium-tungsten probes also have the following characteristics: High melting point High hardness High plasticity High resistivity Low vapor pressure High conductivity Strong thermal conductivity

Probe beryllium copper is often used for low contact resistance or high current. Compared with other probe materials, its hardness characteristics are relatively low, so in terms of wear, it will be faster than other probes. Beryllium copper probes are classified into wafer bodies. Compared with traditional tungsten needles, the softness of beryllium copper probes is much higher and more flexible. Generally, beryllium copper probes are specially developed and manufactured for the LED and LCD industries. It is the best choice for customers with stable performance and effective cost reduction.